2020-12-10
Item:Silicon nitride substrate Material:Si3N4 Color:Gray Thickness:0.25-1mm Surface processing:Double polished Bulk density: 3.24g/㎤ Surface roughness Ra: 0.4μm Bending strength: (3-point method):600-1000Mpa Modulus of elasticity:310Gpa Fracture toughness(IF method):6.5 MPa･√m Thermal conductivity: 25°C 15-85 W/(m･K) Dielectric loss factor:0.4 Volume resistivity: 25°C >1014 Ω･㎝ Breakdown strength:DC >15㎸/㎜ Silicon nitride substrate used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight. Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.
