Metal of Ceramic Substrates

Metal of ceramic substrates:

a. Thick film method: Thick film metallization method, is formed by screen printing on the ceramic substrate, forming a conductor (circuit wiring) and resistance, etc., sintered formation circuit and lead contact, etc. , Oxide and glass and oxide mixing system;
b. Film Law: Metallization by vacuum coating, ion plating, sputtering coating, etc. However, the coefficient of thermal expansion of the metal film and the ceramic substrate should be as best as possible, and the adhesion of the metallization layer should be improved;
c. Co-burning method: On the ceramic green sheet before burning, the thick film slurry of the wire printing Mo, W et al., is defense, so that the ceramics and conductor metal are burn into a structure, this method Has the following features:
■ The fine circuit wiring can be formed, which is easy to achieve multi-layered, so that high-density wiring can be achieved;
■ Due to the insulator and conductor - airtight package;
■ By the selection of ingredients, forming pressures, sintering temperatures, the development of sintering shrinkage, in particular, the development of zero shrinkage substrates in the planar direction is successfully created for use in high-density packages such as BGA, CSP, and bare chips.