Application: For silicon carbide substrates, long extension, multiple use of low voltage circuits and VLSI high cooling packages, such as high speed, high integration logic LSI tape, and super large computers, Light communication credit laser diode substrate application, etc.
Read MoreAluminum nitride substrate: a. Raw material: AIN is a non-natural presence but a artificial mineral in 1862, was first synthesized by Genther et al. The representation of the representation of the Aln powder is to reduce the nitride method and the direct nitridation method. The former is reacting w......
Read MoreFilm Law: Metallization by vacuum coating, ion plating, sputtering coating, etc. However, the coefficient of thermal expansion of the metal film and the ceramic substrate should be as best as possible, and the adhesion of the metallization layer should be improved;
Read MoreTypical forming methods in front of ceramics have four types: powder press forming (molded, etc.), extrusion forming, cast form, and is formed. The casting method is used in the manufacture of substrates for LSI packages and mixed integrated circuits due to easily achievement and high production......
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