‌What are the differences between silicon nitride substrate and substrate?

The main differences between silicon nitride substrate and substrate are their definitions, uses and characteristics. ‌

1. Definition and use

‌Silicon nitride substrate‌: Silicon nitride substrate is a ceramic material mainly used in the manufacture of power semiconductor devices, especially power modules. It has high thermal conductivity, high mechanical strength and good thermal matching, and is suitable for application scenarios requiring high reliability and high temperature resistance. ‌Substrate‌: Substrate usually refers to the underlying support structure used for chip manufacturing. Common substrate materials include single crystal silicon wafers, SOI substrates, SiGe substrates, etc. The choice of substrate depends on specific application requirements, such as integrated circuits, microprocessors, memory, etc. ‌

2. Comparison of characteristics ‌

Silicon nitride substrate‌ ‌

High thermal conductivity‌: The thermal conductivity of silicon nitride is as high as 80 W/m·K or more, which is suitable for the heat dissipation needs of high-power devices. ‌High mechanical strength‌: It has high bending strength and high fracture toughness, ensuring its high reliability. ‌ ‌ Thermal expansion coefficient matching ‌: It is highly similar to the SiC crystal substrate, ensuring a stable match between the two and enhancing the overall reliability ‌.

Substrate ‌

Various types ‌: Including single crystal silicon wafers, SOI substrates, SiGe substrates, etc., each substrate material has its specific application field and performance advantages ‌.

‌Wide range of uses ‌: Used to manufacture different types of chips and devices, such as integrated circuits, microprocessors, memory, etc. ‌.

3. Application scenarios

‌Silicon nitride substrate ‌: Mainly used for high-power devices in fields such as new energy vehicles and modern transportation tracks. Due to its excellent heat dissipation performance, mechanical strength and stability, it is suitable for high reliability requirements in complex environments ‌.

‌Substrate ‌: Widely used in various chip manufacturing, and the specific application depends on the type of substrate. For example, single crystal silicon wafers are widely used in the manufacture of integrated circuits and microprocessors, SOI substrates are suitable for high-performance, low-power integrated circuits, and SiGe substrates are used for heterojunction bipolar transistors and mixed signal circuits, etc. ‌.