How Much Do You Know About Silicon Nitride In Silicon Nitride Substrates?

Today, let me introduce silicon nitride from the performance aspect.

About physical properties

First, the thermal properties of silicon nitride. It is a high-temperature refractory material with no melting point. It decomposes at about 1900℃ under normal pressure. It has strong resistance to high-pressure creep. The load softening point of reactive sintered silicon nitride without binder can be as high as 1800℃. Then it has good thermal conductivity and small thermal expansion coefficient. It also has good electrical insulation, small dielectric constant and high breakdown voltage.

About chemical properties

Silicon nitride has good oxidation resistance and does not react with oxygen in a dry atmosphere below 800℃. In addition, it is resistant to molten metal corrosion and does not wet the elemental metal melt (except copper) and is not corroded. Another characteristic is that it is easily soluble in hydrofluoric acid and does not work with dilute acid.

About mechanical properties

Silicon nitride has good high-temperature strength. The high-temperature strength at 1200°C does not attenuate much compared with the room temperature strength. In addition, its high-temperature creep rate is very low. These are all determined by the nature of strong covalent bonds. It has high hardness, second only to a few superhard materials such as diamond, cubic BN, B4C, etc. It also has a low friction coefficient and self-lubricating properties, similar to the surface of oiled metal.

The above is today's introduction to silicon nitride from the three aspects of physical properties, chemical properties and mechanical properties.