Film Law: Metallization by vacuum coating, ion plating, sputtering coating, etc. However, the coefficient of thermal expansion of the metal film and the ceramic substrate should be as best as possible, and the adhesion of the metallization layer should be improved;
Read MoreTypical forming methods in front of ceramics have four types: powder press forming (molded, etc.), extrusion forming, cast form, and is formed. The casting method is used in the manufacture of substrates for LSI packages and mixed integrated circuits due to easily achievement and high production......
Read MoreBecause of its chemical and physical stability, the hardness and corrosion resistance of silicon carbide are high. Silicon carbide is also called diamond, or it can be said to be diamond. It is only different. High temperature resistance is extremely high, and there is absolutely no problem wit......
Read MoreCeramic substrates are currently used in power electronic modules, advantages: high mechanical strength, toughness and thermal conductivity The silicon nitride has a higher cost higher than the aluminum nitride substrate, and the thermal conductivity is over 80 or more.
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